Electronics · Cold Marking

Laser Marking for Electronics Manufacturing

Fine codes and logos on suitable circuit boards, connectors and coated components. Validate contrast and material integrity on the actual parts.

UV laser marking on electronics PCB

01 — What Can Be Marked

Identification that survives the board process

Part Numbers

Part numbers on IC packages, connectors and housings — legible through conformal coating and reflow processes.

Serial Numbers

Unique serialization per board or component, with automatic sequencing from the marking software.

QR Codes

High-contrast QR codes for board-level traceability, MES uploads and warranty records.

Barcodes

Code 128 and DataMatrix on lead frames, plastic bodies and metal connectors.

Logos

Brand logos and regulatory marks on enclosures, switches and small plastic parts — clean edges at small sizes.

Traceability

Full direct-part traceability — lot, date, line and revision in a single readable field on the board or housing.

02 — Recommended Configurations

Material, requirement, machine, configuration

Typical electronics marking jobs and the configurations we recommend. Confirm on your boards and components with a free sample test.

Material Marking Requirement Recommended Machine Configuration
FR-4 PCB / Circuit Board Fine legend + DataMatrix, no delamination UV 3 W F160 lens · low pulse energy · XY table
ABS / PC Enclosure Crisp logo + serial, no melt marks UV 5 W F160 lens · low power · rotary axis
Glass / Ceramic Component Frosted 2D code, no micro-cracks UV 5 W F160 lens · low pulse energy · rotary axis
Copper Lead Frame / Connector Black serial on metal pin area Fiber 30 W F160 lens · high contrast · XY table
Anodized Aluminum Housing Color logo marking MOPA 30 W F160 lens · pulse-width tuning · rotary axis
Plastic Film / Cable Jacket Batch code on insulation CO₂ 30 W F160 lens · low power · conveyor ready

Specifications are indicative and confirmed during sample testing on your parts.

03 — Process Requirements

Built for SMT lines and clean benches

Electronics marking runs at high volume on small, heat-sensitive parts. The machine must hold micron-level position and contrast without affecting the board, package or component underneath.

  • Cold processing. UV can limit heat effects on suitable materials; melting, bubbling, discoloration and other damage remain possible with unsuitable parameters.

  • Micron precision. Fine line widths and small 2D codes stay readable on lead frames, packages and tight board areas.

  • Line integration ready. Trigger, conveyor and MES signals — standard I/O on every controller for high-volume runs.

  • Clean and residue-free. Fume extraction and enclosed optics keep boards, connectors and sensitive components free of debris.

Configure a machine for your line

Tell us the board, component or enclosure, its material and the marking content. We recommend the UV, fiber or MOPA configuration — sample testing confirms the cold mark first.